6146:TYO
Disco Corp
JP¥63.730,00
0,00%
(0,00) 1D
5 ຕ.ລ., 15 ໂມງ 30 ນາທີ 00 ວິນາທີ GMT+9 · JPY
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| Symbol | Price | Change | % Change |
|---|
insights_autoGenerating top insights for 6146...
Mkt. cap
6,92 ລ້ານລ້ານ
Avg. vol.
1,45 ລ້ານ
Volume
0,00
Dividend
0,79%
Quarterly dividend
JP¥126
Ex-dividend date
29 ກ.ຍ. 2026
P/E ratio
47,49
52-wk high
JP¥91.680
52-wk low
JP¥42.370
EPS
JP¥1.342
Shares outstanding
35,93 ລ້ານ
No. of employees
6 ພັນ
Mkt. cap
6,92 ລ້ານລ້ານ
Avg. vol.
1,45 ລ້ານ
Volume
0,00
Dividend
0,79%
Quarterly dividend
JP¥126
Ex-dividend date
29 ກ.ຍ. 2026
P/E ratio
47,49
52-wk high
JP¥91.680
52-wk low
JP¥42.370
EPS
JP¥1.342
Shares outstanding
35,93 ລ້ານ
No. of employees
6 ພັນ
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Profile
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor production industry.
The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.
The company is listed on the Tokyo Stock Exchange, where it is a component of the Nikkei 225 index. Wikipedia
About Disco Corp
CEOKazuma Sekiya
Employees5,55 ພັນ
Founded5 ພ.ພ. 1937
Headquarters-
SectorSemiconductor
Websitedisco.co.jp