6146:TYO
Disco Corp
61 460,00 JP¥
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+0,52%(+320,00) 1D
9-окт., 15:30:00 GMT+9 · JPY
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|---|
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Open
59 610 JP¥
High
61 460 JP¥
Low
59 310 JP¥
Mkt. cap
6,67 трлн
Avg. vol.
1,57 млн
Volume
1,50 млн
Dividend
0,82%
Quarterly dividend
126 JP¥
Ex-dividend date
2026-ж., 29-сен.
P/E ratio
45,80
52-wk high
91 680 JP¥
52-wk low
42 370 JP¥
EPS
1 342 JP¥
Shares outstanding
35,93 млн
No. of employees
6 миң
Open
59 610 JP¥
High
61 460 JP¥
Low
59 310 JP¥
Mkt. cap
6,67 трлн
Avg. vol.
1,57 млн
Volume
1,50 млн
Dividend
0,82%
Quarterly dividend
126 JP¥
Ex-dividend date
2026-ж., 29-сен.
P/E ratio
45,80
52-wk high
91 680 JP¥
52-wk low
42 370 JP¥
EPS
1 342 JP¥
Shares outstanding
35,93 млн
No. of employees
6 миң
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Profile
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor production industry.
The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.
The company is listed on the Tokyo Stock Exchange, where it is a component of the Nikkei 225 index. Wikipedia
About Disco Corp