6146:TYO
Disco Corp
JP¥76 590,00
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-0,35%(-270,00) 1D
3 Jul., 15:30:00 GMT+9 · JPY
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Open
JP¥74 000
High
JP¥76 910
Low
JP¥72 750
Mkt. cap
8,31 bn
Avg. vol.
1,84 m
Volume
1,57 m
Dividend
0,66%
Quarterly dividend
JP¥126
Ex-dividend date
29 Sep. 2025
P/E ratio
61,47
52-wk high
JP¥91 680
52-wk low
JP¥37 260
EPS
JP¥1 246
Shares outstanding
35,93 m
No. of employees
6 k
Open
JP¥74 000
High
JP¥76 910
Low
JP¥72 750
Mkt. cap
8,31 bn
Avg. vol.
1,84 m
Volume
1,57 m
Dividend
0,66%
Quarterly dividend
JP¥126
Ex-dividend date
29 Sep. 2025
P/E ratio
61,47
52-wk high
JP¥91 680
52-wk low
JP¥37 260
EPS
JP¥1 246
Shares outstanding
35,93 m
No. of employees
6 k
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Profile
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor production industry.
The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.
The company is listed on the Tokyo Stock Exchange, where it is a component of the Nikkei 225 index. Wikipedia
About Disco Corp
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