6146:TYO
Disco Corp
Â¥54,460.00
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+0.78%(+420.00) 1D
Sep 4, 3:30:00 PM GMT+9 · JPY
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| Symbol | Price | Change | % Change |
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insights_autoGenerating top insights for 6146...
Open
Â¥54,000
High
Â¥55,100
Low
Â¥53,740
Mkt. cap
5.91T
Avg. vol.
1.79M
Volume
1.29M
Dividend
0.93%
Quarterly dividend
Â¥126
Ex-dividend date
Sep 29, 2026
P/E ratio
40.58
52-wk high
Â¥91,680
52-wk low
Â¥37,470
EPS
Â¥1,342
Shares outstanding
35.93M
No. of employees
6K
Open
Â¥54,000
High
Â¥55,100
Low
Â¥53,740
Mkt. cap
5.91T
Avg. vol.
1.79M
Volume
1.29M
Dividend
0.93%
Quarterly dividend
Â¥126
Ex-dividend date
Sep 29, 2026
P/E ratio
40.58
52-wk high
Â¥91,680
52-wk low
Â¥37,470
EPS
Â¥1,342
Shares outstanding
35.93M
No. of employees
6K
Profile
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor production industry.
The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.
The company is listed on the Tokyo Stock Exchange, where it is a component of the Nikkei 225 index. Wikipedia
About Disco Corp